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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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ATLANT 3D, UC Berkeley Sign MoU to Advance Materials Innovation and A-HUB California

09/28/2026 | PRNewswire
ATLANT 3D and the University of California, Berkeley (UC Berkeley) have signed a Memorandum of Understanding to advance research, technology development, and innovation infrastructure in California.

Sensetics Raises $1.75M to Take Touch Sensing and Haptics into the Digital Age

11/17/2025 | PRNewswire
Sensetics, a next generation haptics and touch data company advancing the digital capture and transmission of realistic touch experiences and bridging the machine and physical worlds by bringing touch to AI, announced it has raised $1.75mm in pre-seed funding to accelerate product development efforts for its breakthrough hardware and software platform.

Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley

04/17/2025 | PRNewswire
Lam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.

UC Berkeley, SKS Partners Unveil Proposed 36-Acre R&D Hub in the Heart of Silicon Valley at NASA’s Ames Research Center

10/17/2023 | BUSINESS WIRE
A joint venture between The University of California, Berkeley and San Francisco-based SKS Partners, unveiled Berkeley Space Center at NASA Research Park, a planned 36-acre innovation hub in the heart of Silicon Valley.

Thinnest Ferroelectric Material Ever Paves the Way for New Energy-efficient Devices

10/21/2022 | Argonne National Laboratory
As electronic devices become smaller and smaller, the materials that power them need to become thinner and thinner. Because of this, one of the key challenges scientists face in developing next-generation energy-efficient electronics is discovering materials that can maintain special electronic properties at an ultrathin size.
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