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Doug Brooks Webinar: Thermal Conductivity of PCB Dielectric Materials
January 6, 2016 | I-Connect007Estimated reading time: 1 minute
Veteran PCB design instructor Doug Brooks will be teaching a webinar at 1 pm on January 14, 2014. This webinar, scheduled for 1 pm Eastern, will be a discussion of the importance of thermal conductivity data to PCB design, along with an example of a problem in which direct measurement of thermal conductivity explains an apparent inconsistency between measured empirical data and theoretical modelling.
PCBs are ubiquitous in modern technology. For those traces that will carry a significant current, it is important to size the trace correctly in order to control the temperature of the trace. Too small a trace can result in excessive temperature (reliability is directly related to trace temperature) while too large a trace can waste valuable board area.
Increasingly, PCB designers are looking to computer thermal modelling and simulation to optimize trace size. Imperative to the construction of an accurate simulation model is accurate thermal conductivity data, which can vary for PCB materials from manufacturer to manufacturer and in some cases even from batch to batch.
Brooks is the founder of the design bureau UltraCAD Design, and he is the author of and design bureau owner of "Signal Integrity Issues and Printed Circuit Board Design" and "PCB Currents: How They Flow, How They React."
For more information, or to register, click here.
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