Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
EMA Design Automation Announces Unprecedented OrCAD Offer for Innovators
January 13, 2016 | EMA Design AutomationEstimated reading time: 3 minutes
EMA Design Automation, a full-service provider of EDA solutions, has announced a North American promotion aimed at IoT, Maker and other innovators to realize their creativity with industry proven Cadence OrCAD Capture technology.
“OrCAD Capture is the de facto industry standard schematic capture product in the business,” said Manny Marcano, president and CEO of EMA Design Automation. “In today’s economy there are many innovators in large and small companies that want to bring their ideas to life as products, but might not have the budget for the best tools and are forced to use mediocre tools because of the cost. We want to fix this situation.”
Typically, throughout the EDA industry, the initial purchase of any product includes software cost and a one-year maintenance cost. To address the needs of the innovator, EMA is offering Cadence OrCAD Capture for only the cost of maintenance.
Many startups and companies with reduced budgets are forced to use tools that do not enable their future needs. When the innovator’s needs surpass the tool capabilities, like not being supported by a component vendor for a reference design, or failing to grow with the company’s increasing technology needs, the cost of ownership skyrockets as the tools impact user productivity. When designers start with OrCAD Capture, they do not experience these problems. OrCAD with Allegro® technology provides the only fully scalable PCB design solution and is used by companies of all sizes creating designs of all complexities.
Along with access to the industry leading OrCAD Capture software this offer provides additional service and support benefits that are not available with traditional free / low-cost options. This helps innovators rest assured that when deadlines are looming or they need assistance, the PCB design experts at EMA will be available to provide support and answer questions quickly.
Page 1 of 2
Share on:
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.