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Nan Ya PCB Reports Weak Overall Results for 1H 2024

07/18/2024 | Nan Ya PCB
Taiwan-based Nan Ya PCB Co. Ltd has posted weak results for the first half of 2024.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2

07/17/2024 | I-Connect007 Editorial Team
In this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.

Zhen Ding Releases June 2024 Monthly Revenue Report

07/10/2024 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported June 2024 revenue of NT$10,715 million, up 31.84% YoY, reaching the second highest for the same period in the company’s history.

Scanfil Helps with KIS Evo Booth Visualization

06/26/2024 | Scanfil
Together with KIS (part of the ME Group), one of Scanfil’s key customers in Myslowice Poland, we wanted to bring the product to life and show how complex a photo booth can be.

NextFlex Launches $5.3 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Promote Commercialization of Hybrid Electronics

06/10/2024 | BUSINESS WIRE
NextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, today released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 9.0 project value is expected to exceed $11M (including NextFlex investment and performer cost-share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex’s formation to $143M.
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