-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
OCM Manufacturing to Build Concrete Sensor Technology for Giatec Scientific
February 22, 2016 | OCM ManufacturingEstimated reading time: 1 minute
Canadian contract electronics manufacturer OCM Manufacturing has signed an agreement with Giatec Scientific Inc. to manufacture Giatec's SmartRock electronic concrete temperature monitoring device.
SmartRock is a rugged waterproof wireless sensor for monitoring the temperature and maturity of concrete from fresh to hardened stage. This information is analyzed using a mobile app to estimate the real-time strength of concrete.
George Henning, president of OCM Manufacturing, said that OCM is excited to be working with Giatec on such an innovative product. "We specialize in the manufacture of electronics products that are often targeted at important niche or under-served markets. SmartRock is an excellent case in point and we look forward to a long relationship with Giatec Scientific."
The SmartRock sensor is placed directly in formwork at the pouring stage and enables wireless and continuous monitoring of concrete temperature and strength, which is critical to the successful utilization of concrete in modern structures. The product has several benefits: optimization of formwork removal times, more accurate assessments of load on structures and it enables the ongoing adjustment of curing temperatures. Data is recorded on the SmartRock memory and downloaded and shared via a smartphone or tablet computer on-site during concrete setting and hardening.
"The OCM team worked with us to ensure that they not only had a thorough understanding of our product, but that we had the most efficient manufacturing process for our needs," said Dr. Aali R. Alizadeh, CEO of Giatec Scientific.
Suggested Items
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
09/25/2024 | I-Connect007 Editorial TeamDirect-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. SwaminathanNear-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.