Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
OCM Manufacturing to Build Concrete Sensor Technology for Giatec Scientific
February 22, 2016 | OCM ManufacturingEstimated reading time: 1 minute
Canadian contract electronics manufacturer OCM Manufacturing has signed an agreement with Giatec Scientific Inc. to manufacture Giatec's SmartRock electronic concrete temperature monitoring device.
SmartRock is a rugged waterproof wireless sensor for monitoring the temperature and maturity of concrete from fresh to hardened stage. This information is analyzed using a mobile app to estimate the real-time strength of concrete.
George Henning, president of OCM Manufacturing, said that OCM is excited to be working with Giatec on such an innovative product. "We specialize in the manufacture of electronics products that are often targeted at important niche or under-served markets. SmartRock is an excellent case in point and we look forward to a long relationship with Giatec Scientific."
The SmartRock sensor is placed directly in formwork at the pouring stage and enables wireless and continuous monitoring of concrete temperature and strength, which is critical to the successful utilization of concrete in modern structures. The product has several benefits: optimization of formwork removal times, more accurate assessments of load on structures and it enables the ongoing adjustment of curing temperatures. Data is recorded on the SmartRock memory and downloaded and shared via a smartphone or tablet computer on-site during concrete setting and hardening.
"The OCM team worked with us to ensure that they not only had a thorough understanding of our product, but that we had the most efficient manufacturing process for our needs," said Dr. Aali R. Alizadeh, CEO of Giatec Scientific.
Share on:
Suggested Items
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.