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EIPC Speednews: News from the European PCB Industry
March 4, 2016 | EIPCEstimated reading time: Less than a minute

- The Promise of Artificial Intelligence Unfolds in Small Steps
- Schweizer Electronic fulfills expectations for turnover and earnings and takes a confident view of perspectives for 2016
- CFP 24th FED Conference, September 15–16, 2016, Berlin
- Smart Systems Integration 2016: Attractive conference program with many highlights
- POLAR NEWS - March 2016
- News from IPC
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Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds Finalization of First CHIPS Award for Polar Semiconductor
09/30/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act.
Biden-Harris Administration Announces First CHIPS Award to Polar Semiconductor, Establishing U.S. Foundry
09/25/2024 | NISTAs part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities of up to $123 million in direct funding to Polar Semiconductor (Polar).