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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Register Now for Cadence’s CDNLive Silicon Valley
March 9, 2016 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Don’t miss the Early Bird $99 registration pricing for CDNLive Silicon Valley. This annual conference brings together Cadence users, developers, and industry experts to connect, share ideas, and inspire design creativity. Take advantage of this unique opportunity to investigate design challenges and share solutions with people who, like you, are excited about the latest advances in electronic design.
CDNLive Silicon Valley 2016 takes place at the Santa Clara Convention Center April 5-6, 2016. Highlights include:
- User-presented technical papers that will immediately help improve how you use Cadence technologies
- Executive keynotes offering insights into industry trends and innovations
- Peer networking opportunities
- Live product demos and technology updates
Papers: Choose from a wide variety of user-authored papers addressing all aspects of IP integration, SoC design, and system integration as well as board design, implementation, signoff, and verification. Discover how others are using Cadence technologies and techniques to develop successful silicon, SoCs, and systems.
Keynote speakers: Hear from industry leaders who influence the global electronics marketplace as they discuss industry trends in silicon, SoC, and system realization and share their thoughts on how to solve the most pressing design challenges. Keynote speakers will be announced soon!
Designer Expo: Check out our showcased solutions and new products co-developed by Cadence and Cadence Connections partners.
Networking opportunities: Engage in technical discussions with your peers and stay connected after the conference.
Early Bird registration ends March 18, 2016.
Click here to register.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Journey from Dilution to Zero Liquid Discharge
05/11/2026 | Richard Nichols, GreenSource EngineeringIf you’re familiar with the PCB industry, and a little long in the tooth like me, you may remember the cry, “The water board is here!” (or an equivalent authority). This was the signal for a frantic but regularly rehearsed exercise to turn on all the rinses. This anecdote demonstrates that in the early days of PCB production, prevailing practices revolved around a “dilution is the solution” mentality, in which manufacturers used copious amounts of water to dilute contaminants before discharging them into regulated municipal wastewater systems or natural water bodies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.