-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Manufacturing Institutes Can Boost the Nation
March 10, 2016 | Dr. John Mitchell, IPCEstimated reading time: 2 minutes
In his most recent State of the Union address, President Obama highlighted a remarkable trend of recent years: the turnaround in many corners of America’s manufacturing sector. Nearly 900,000 new jobs have been created by U.S. manufacturers in the last six years. To accelerate this trend President Obama has promoted the launch of a network of “next-generation” manufacturing hubs— including the new NextFlex Institute in Mountain View, and six others established over the last year.
But the long-term growth outlook is unclear. The number of jobs in the manufacturing sector is still 1.4 million below the level when the recession began in December 2007; and in late 2015 the nation’s leading manufacturing index contracted at its fastest pace since June 2009, following a months-long slide.
Clearly, there is more work to do to shore up U.S. manufacturing, and the innovation hubs mentioned by President Obama are part of the solution.
As proposed by the President in 2012 and authorized by Congress in 2014, the National Network for Manufacturing Innovation (NNMI) is bringing together private companies, government agencies, universities, community colleges, and other state and local organizations with a goal of bridging the gap between basic research and product development. They aim to accelerate innovation by pooling resources and investment in emerging manufacturing technologies with broad applications. The institutes also give companies access to cutting-edge equipment and opportunities for workforce training.
The NextFlex Institute in San Jose, CA announced last August, is the seventh incubator in the network, and the first on the West Coast. Last year, a consortium of 96 companies, 11 laboratories and non-profits, 43 universities, and 15 state and regional organizations, including the City of San Jose, secured an award of $75 million from the Pentagon and $108 million in private funding to launch the “flexible hybrid electronics” initiative.
Unlike traditional circuit boards mounted on rigid green plastic, flexible circuits embedded in fabric or film could pave the way to many exciting innovations: medical implants that conform to bones and organs; lighter communications gear built into military uniforms; or solar cells on a roll of plastic.
IPC has joined NextFlex as a partner and will apply its strength and expertise in standards development to assist the institute in creating roadmaps for industry standards for flexible hybrid electronics manufacturing. Our collaborative efforts will provide the printed electronics community with the standards and education needed to advance this technology, shorten product lead times, and improve product performance.
Other NNMI institutes are focusing on hot areas such as 3D printing, lightweight materials, and advanced semiconductors.
But here again, the good news is tempered by a dose of reality. Congress, the Executive Branch, and all of the institute’s partners must keep up their long-term commitment to adequate funding and coordination.
Congressional appropriators—including Silicon Valley’s Rep. Mike Honda— provided $25 million in 2016 funding for new institutes and $5 million for coordination by the National Institute for Standards and Technology (NIST). This funding level is small in comparison to the scope of the challenge and the demonstrated appetite from the private sector. But the return on investment on even that amount should be huge. Congress will have another opportunity to provide more innovation seed money in the 2017 budget.
In an era of partisan rancor, the bipartisan support for the NNMI reveals a strong consensus in favor of accelerating the nation’s manufacturing sector and reinvesting in America’s technology leadership. Now more than ever, U.S. policymakers need to nurture the green shoots of the manufacturing revival.
Dr. John Mitchell is president of IPC – Association Connecting Electronics Industries, representing an estimated 800,000 people employed in 2,200 U.S. member facilities.
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.