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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Elects New Officers and Members to IPC Board
March 16, 2016 | IPCEstimated reading time: 2 minutes
The Nominating and Governance Committee of the IPC Board of Directors presented nine candidates for election at the IPC Annual Meeting on March 15, held in conjunction with IPC APEX EXPO 2016 at the Las Vegas Convention Center. Three candidates were elected as Board officers and will serve two-year terms. Three were elected as new Board members and three were selected for term renewal. All six Board members will serve a four-year term.
The newly elected Board officers are:
- Chairman of the Board – Joe O’Neil, Owner, OAA Ventures
- Vice Chairman – Mikel Williams, President and CEO, Targus
- Secretary/Treasurer – Shane Whiteside, Executive Director, AvaSure
The newly elected Board members are:
- First-term director – Tom Edman, President and CEO, TTM Technologies
- First-term director – Robert Feuerstein, Director, Head of CEP MT, Continental Automotive, GmbH
- First-term director – Steve Pudles, Origo Acquisition Company
- Term renewal – Tony Zhou, President, RayVal (Suzhou) Technologies Co. Ltd.
- Term renewal – Mike Carano, Vice President, Technology and Business Development, RBP Chemical Technology.
- Term renewal – Bob Neves, Chairman and Chief Technology Officer, Microtek (China) Laboratories
"IPC is privileged to have these directors and officers added to our current slate of Board members. All are active contributors to IPC initiatives and we look forward to their continued contributions to advancing IPC and industry," said John Mitchell, IPC president and CEO.
In addition to holding Board elections, IPC honored outgoing Board chairman, Marc Peo, president, Heller Industries. Peo will serve as the Immediate Past Chair on the IPC Board of Directors Executive Committee for a two-year term.
For additional information on IPC's Board of Directors including bios on newly elected Board members, contact Sandy Gentry, IPC communications manager, at SandyGentry@ipc.org.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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Simon Khesin - Schmoll MaschinenSuggested Items
The Journey from Dilution to Zero Liquid Discharge
05/11/2026 | Richard Nichols, GreenSource EngineeringIf you’re familiar with the PCB industry, and a little long in the tooth like me, you may remember the cry, “The water board is here!” (or an equivalent authority). This was the signal for a frantic but regularly rehearsed exercise to turn on all the rinses. This anecdote demonstrates that in the early days of PCB production, prevailing practices revolved around a “dilution is the solution” mentality, in which manufacturers used copious amounts of water to dilute contaminants before discharging them into regulated municipal wastewater systems or natural water bodies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.