-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Patricia (Patty) Goldman Inducted into IPC Hall of Fame
March 18, 2016 | Barry Matties, I-Connect007Estimated reading time: 10 minutes
I've seen some things over the years. When I first started, the industry with the strongest influence in IPC was the military. There were also a lot of captive shops—GE, IBM, AT&T’s Western Electric, many others. All the big companies had captive shops and oftentimes, multiple shops. Then that started to change, and they became less influential and the commercial companies became more influential. Eventually, all the big guys realized they didn't need to have their captive shops. They were always behind in the technology anyhow, at those captive shops. You’d think they wouldn't be, but they were behind in technology. Sounds counter-intuitive but that’s what I saw.
Matties: I thought the R&D was coming out of the captive shops.
Goldman: They had blinders on. Many did have their own R&D, which was perhaps best practice or perhaps not. But they didn’t really have to compete, so they weren’t constantly looking for the best technology, and then there was the NIH factor (“not invented here”). I could tell you a lot of stories. Maybe not best practice, but it was their way of doing it.
Matties: I understand what you're saying. It was good for them, but not necessarily good for the industry.
Goldman: Yeah. I was in a shop out in Ohio, NCR, when they still had a circuit board operation, and they were using this make-and-dump electroless copper bath. They would dump it every day! I thought, that's at least 20 years behind the times. They just had their own way of doing things, and they were not forced to change because they had a captive customer—themselves. They did not have to work to be more efficient and look for better ways of doing things. And it really wasn’t good for them either.
Matties: So here you are, 30+ years later, and you are now being inducted into the IPC Hall of Fame, and receiving that award. Additionally, I think you are the first female recipient of this award. Now that you've done that, what are you going to do next? Go to Disneyland?
Goldman: No, I’m a bigger fan of Disney World anyhow, as you know. [laughs] It is such an honor. But every time you receive an award from IPC, they put you back to work. When I got the President's Award in 1984, Don Dinella, Mr. Additive Circuits, said to me, "Now they'll really put you to work!" It's true. They do tend to tap the people that they know will get things done—why not?
So now I am thinking, this is a big one; they're really going to be tapping me for something or other. I know they call the Hall of Fame people “ambassadors.” I'll find out what that's all about.
Matties: I'm sure you will.
Goldman: One interesting thing I learned while I was TAEC Chairman, which I didn't realize before. IPC has its board of directors, of course, but the chair of TAEC is in on some of the meetings that involve giving direction to IPC. You represent all the chairs who represent all of the committees, which are of course the lifeblood of IPC. That was really interesting.
Matties: Well congratulations, Patty. This is great news and I’m happy to see you receive this award.
Goldman: It still seems kind of unreal, but such a huge honor. It seems a little unreal to me because of all of the people that have received this before me. All but the first two I know or have known pretty well—they are people I have always looked up to, that have done so much for the industry and have influenced so much. Several I would consider mentors, including Bernie Kessler, Don Dinella and Dieter Bergman. So I'm thinking, me? Really? Are you sure? Do I really fit into this august group? I hope I can live up to the examples set by those already in the Hall of Fame.
Matties: It was and is you, so congratulations. You deserve it.
Goldman: Thank you.
Matties: Are there any closing thoughts that you want to share with the industry?
Goldman: I've been asked to say a few words when I am inducted on Tuesday, and one of the big things I want to say, and we say it all the time, is to volunteer, to work on a committee or subcommittee. Don't just sit in a room and listen, but actually get involved. Not only can you help write and develop a standard that is important to you, but you can actually participate and have an effect and influence on how things are done and written.
If you're a passive bystander type person, you may learn some things, but you won't learn nearly as much as you can by getting involved, and of course, it just has so many benefits for you and your company.
Matties: Great. Again, congratulations, and thank you so much, Patty.
Goldman: Thanks. I am truly honored.
Page 2 of 2Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.