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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Mentor Paper: Take Command of Thermal Optimization During PCB DesignMarch 23, 2016 | Mentor Graphics
Estimated reading time: Less than a minute
Computational fluid dynamics software tools can be useful in considering the effect on a printed circuit board of such things as package selection, board layout and structure as well as enclosure design.
This Mentor Graphics white paper explains:
- Approaches to PCB thermal management studies with CFD
- Automating PCB thermal design modifications using Design of Experiments
- Utilizing parametric studies to explore a range of operating scenarios early in the design process
- Example: Heatsink optimization for cPCI card for cost-effective design
- Tradeoffs: Heat sink geometry & mass vs component allowable temperature ranges and layout
One of my great joys as a grandfather of eight is spending time with them at the park. It doesn't take too long until I'm getting stuck on a slide that is too small for me or on the seesaw, with me on one side and them trying to lift me. At that point, they learn some harsh lessons in physics and how heavy Grandpa really is. A seesaw is a relatively simple device, but it’s a great way to explain a rather complex concept in PCB design: design tradeoffs. Each decision made throughout a design comes with inherent pros and cons.
Spirit AeroSystems, Inc. announced the grand opening of its Engineering Design Center in Subang, Malaysia, that expands the company’s global engineering capabilities, during opening day of the 2024 Singapore Air Show.
It’s been another busy week in the industry. We lost another old friend last week. The EIPC show happened, and Pete Starkey provided us with complete and compelling show coverage, from start to finish. Recently, we posed the question, “When is it time to introduce embedded components into your PCB design?” which was asked and answered by design aficionado Kris Moyers in the latest issue of Design007 Magazine. We are proud to be a part of the exciting Global Insights weekly newsletter, which Nolan Johnson and Brian Knier explored in their interview, and we rounded out the week with some big merger news. Here are my picks for the past week’s must-read news items.
ROCKA Solutions is pleased to announce its partnership with Vega Industries, Inc., a manufacturer of premium-quality driver bits and fastener driving tools. Under this collaboration, ROCKA Solutions is a distributor for Vega Industries' top-notch tools designed for precision and durability.
Aismalibar will be attending the APEC, the leading conference for practicing power electronics professionals, in Long Beach, California from February 25th to 29th, 2024 in Booth 552. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS).