Control Algorithm for Accurate Lab-on-a-chip Devices
April 5, 2016 | POSTECHEstimated reading time: 1 minute

Prof. Wan Kyun Chung (Dept. of Mechanical Engineering) with PhD student Young Jin Heo, MS student Junsu Kang, and postdoctoral researcher Min Jun Kim in the Robotics Laboratory, have developed a novel control algorithm to resolve critical problems induced from a Proportional-Integral-Derivative (PID) controller by automatizing the technical tuning process. Their research was published in Scientific Reports.
Lab-on-a-chip designates devices that integrate various biochemical functions on a fingernail-sized chip to enable quick and compact biological analysis or medical diagnosis by processing a small volume of biological samples, such as a drop of blood. To operate various functions on a lab-on-a-chip device, the key technology is the precise and rapid manipulation of fluid on a micro-scale.
In microfluidic devices, very small and trivial variables can frequently cause a large amount of errors. Up until now, Proportional-Integral-Derivative (PID) controller has normally been used for the manipulation of fluids in microfluidic chips. To apply the PID controller, a tedious gain-tuning process is required but the gain-tuning is a difficult process for people who are unfamiliar with control theory. Especially, in the case of controlling multiple flows, the process is extremely convoluted and frustrating.
The developed control algorithm can improve accuracy and stability of flow regulation in a microfluidic network without requiring any tuning process. With this algorithm, microfluidic flows in multiple channels can be controlled in simultaneous and independent way. The team expects that this algorithm has the potential for many applications of lab-on-a-chip devices. For example, cell culture or biological analysis, which are conducted in biology laboratories, can be performed on a microfluidic chip. Physical and chemical responses can be analyzed in the subdivided levels.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in