-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Happy’s Essential Skills: Failure Modes and Effects Analysis (FMEA)
April 6, 2016 | Happy HoldenEstimated reading time: 12 minutes
When analyzing system or subassembly functions affected by factors, consider this list:
Corrective Actions
When the failure modes have been rank ordered by RPN, corrective action should be first directed at the highest ranked concerns and critical items. If a recommended action might be a design of experiments (Plackett-Berman or Taguchi Method). The intent of any recommended action is to reduce the occurrence, severity and/or detection ranking.
What is Process FMEA (P-FMEA)?
Definition
A process potential FMEA (P-FMEA) is an analytical technique utilized by manufacturing/process engineers as a means to assure that, to the extent possible, potential concerns have been considered and addressed. In its most rigorous form, a P-FMEA is a summary of the engineer’s thoughts (including an analysis of items that could go wrong based on experience and past concerns) as a process is developed. This systematic approach parallels and formalizes the mental discipline that an engineer normally goes through in any manufacturing planning process.
The P-FMEA identifies potential product-related process failure modes, assesses the potential down-stream effects of the failures, identifies the potential manufacturing or assembly process causes, and identifies failure modes ranking according to their effect on the customer, thus establishing a priority system for corrective action considerations. The P-FMEA also documents the results of the manufacturing or assembly process.
Here is a list of activities for a P-FMEA:
1. Determine potential concerns that might cause failure modes for each process or subassembly and causes associated with the designing and manufacturing of a product
2. Identify actions which could eliminate or reduce the chance of a potential process failure occurring
3. Document the process and give each mode a numeric rating for frequency of occurrence, criticality, and probability of detection. Finally, multiply these three numbers together to obtain the RPN, which is used to guide the design effort to the most critical problems first.
Two aspects of P-FMEA are particularly important: a team approach, and timeliness. The team approach is vital because the broader the expertise that is brought to bear on making and assigning values to the failure mode list, the more effective the P-FMEA will be.
Timeliness is important because P-FMEA is primarily a preventive tool, which can help steer manufacturing development decisions between alternatives before failure modes are built-in, rather than reworking after the failure occurs. P-FMEA is equally applicable to hardware or software.
Steps in Performing P-FMEA
1. Discuss and define manufacturing and process functional requirements, including all modes of operation (list in order of decreasing importance).
2. Develop a functional block diagram and a reliability block diagram (Figure 2) for each manufacturing/process being analyzed.
3. Define parameters and functions of each functional block required for successful operation of the process.
4. Using the FMEA forms to document the further steps, identify potential failure modes for each of the functional blocks.
5. Analyze process or subassembly functions affected by factors such as those in the list of FMEA considerations.
6. Identify all possible causes for each failure mode of the functional block being analyzed. The causes must be detailed to the component level wherever possible.
7. Identify all possible ways the failure modes could affect the functions of the higher level manufacturing steps or processes or assemblies.
8. Assign the frequency, criticality, and detection values for each failure mode. (Tables 1–3).
9. Obtain the RPN by multiplying the three values assigned in step 8. This priority number will allow us to focus on the most important failure modes first.
10. Determine corrective actions for each failure mode, and update the manufacturing documentation as it progresses.
11. Summarize the failure modes and corrective actions in order of decreasing RPN.
12. Focus on eliminating at least the 50% of the failure modes with the highest RPN.
Summary
FMEA and P-FMEA are continuing processes that should be initiated at investigation/launch time of the design cycle and then be regularly updated as changes occur throughout the phases of product development. FMEA must be completed before the design is frozen, for its purpose is to affect the design and harden it against failures due to causes that can be anticipated. Potential manufacturing or assembly concerns known by the design engineer should be conveyed to the production engineers, using means such as the P-FMEA team meetings.
References
1. Procedures for Performing FM ECA, MIL-ST D-162, available from National Technical Information Service, Springfield VA 22161.
2. O'Connor, P.D.T., Practical Reliability Engineering, 2nd Edition, John Wiley & Sons, 1985. ISBN 0-471-90551-8.
3. Potential Failure Modes and Effects Analysis, Ford Motor Co., Sept. 1988. Available from FORD, Electronics Division, P.O. Box 6010, Dearborn, MI 48121-6010. Attn: Supplier Quality Manager.
4. Ireson & Coombs, Handbook of Reliability Engineering and Management, McGraw-Hill, 1988. ISBN 0-07-032039-X.
Seminars
- Reliability in Product Design and Testing, American Supplier Institute, 6 Parkland Blvd. Suite 411, Dearborn MI 48126. Contact: (313) 336-8877.
- Applied Reliability Engineering and Product Assurance for Engineers and Managers, Univ. of Maryland, Center for Professional Development, University Blvd. at Adelphi Rd., College Park MD 20742-1668. Contact: (301) 985-7157.
- Reliability Training Program (videotape seminar), Technicomp Inc., 1111 Chester Avenue, 300 Park Plaza, Cleveland OH 44114. Contact: (216) 687-1122.
Software Tools
- PC FMECA (IBM PC Program), Management Sciences Inc., 6022 Constitution Ave. NE, Albuquerque, NM 87110. Contact: (505) 255-8611.
- TreeMaster (IBM PC Program), Management Sciences Inc., 6022 Constitution Ave. NE, Albuquerque, NM 87110. Contact: (505) 255-8611.
- Results (FTA Program), Management Sciences Inc., 6022 Constitution Ave. NE, Albuquerque, NM 87110. Contact: (505) 255-861.
Happy Holden has worked in printed circuit technology since 1970, with Hewlett-Packard, NanYa/Westwood, Merix, Foxconn and Gentex. He is the co-editor, with Clyde Coombs, of the Printed Circuit Handbook, 7th Ed. To contact Holden, click here.
Page 5 of 5
Suggested Items
Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
04/11/2025 | AvnetDesign engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
04/09/2025 | Real Time with...IPC APEX EXPOPeter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
The Shaughnessy Report: Always With the Negative Waves
04/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I started covering PCB design in the ‘90s, RF designers comprised a small percentage of the design community. Other than cellphones and handheld GPS devices, RF wasn’t seen very often outside of military, aerospace, and law enforcement applications. Now, RF is everywhere. Almost every electronic device in your house and pocket—your cellphone, tablet, laptop, smartwatch, and wireless/smart speaker—contains RF technology. The entire wearable segment is built on RF technology
Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
04/08/2025 | SiemensSiemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.