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Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

SMTA Austin Expo & Tech Forum Returns February 6, 2025

10/30/2024 | SMTA
The Surface Mount Technology Association (SMTA) Austin Expo & Tech Forum is set to take place on Thursday, February 6, 2025 from 8:30 a.m. - 4:00 p.m. at the Travis County Exposition Center.

SMTAI Returns to Its Chicago Roots

10/28/2024 | Nolan Johnson, SMT007 Magazine
SMTA International, the anchor conference and exhibition for SMTA, returned to the Stephens Convention Center in Rosemont, Illinois, Oct. 20–24. After a COVID hiatus, followed by two years of co-locating with the MDMA show in Minneapolis, SMTAI went back to its Chicagoland home turf. The 2024 installment of the SMTAI event included more than 110 exhibitors, co-location with The ASSEMBLY Show, over 100 technical papers in the conference, technical forums, social activities, and renewed enthusiasm in the attendants.

2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future

10/24/2024 | IPC
The 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.

Yamaha Robotics Appoints Roberto Ferraretto New Area Manager for Italy

10/23/2024 | Yamaha Robotics
Yamaha Robotics SMT Section has announced that Roberto Ferraretto has joined the team as Area Manager for Italy, to support the Company’s range of printers, mounters, inspection systems, and software for high-speed surface-mount and hybrid assembly.
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