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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
April 19, 2016 | Andy Shaughnessy, PCBDesign007Estimated reading time: 1 minute
The Tehnici de Interconectare in Electronica (Interconnection Techniques for Electronics) PCB design conference takes place April 20-23 in Suceava, Romania. Joe Fjelstad, founder of Verdant Electronics, will give the keynote speech titled, “An Overview of Electronic Manufacturing Technology Evolution and Trends.” The keynote will kick off the awards ceremony on the evening of April 22.
The event brings together the leaders of Romania’s academia and the electronics industry, culminating in a PCB design contest for college students. Thirteen universities will send three PCB designers each to TIE. The students will spend four days in PCB design workshops and compete in a design contest known as “The Olympic Games for PCB Designers.” Winners are awarded a “PCB Designer Certificate of Competence.”
The TIE conference was founded by Dr. Paul Svasta, a professor of electrical and electronic manufacturing at Politehnica University of Bucharest – CETTI. This year marks the 25th TIE conference.
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Fabrinet Announces Q3 Fiscal Year 2026 Financial Results
05/11/2026 | FabrinetFabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its third fiscal quarter ended March 27, 2026.
IMI Reports Q1 2026 Results, Delivering Higher Profitability and Stable YoY Revenue
05/11/2026 | IMIIntegrated Micro-Electronics, Inc. (IMI), a global electronics manufacturing services provider, announced financial results of the first quarter of 2026 highlighting improved profitability and margin expansion, underscoring the effectiveness of its ongoing transformation initiatives despite pockets of market softness in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.