Punching Out: Entrepreneurship Through Acquisition Buyers for PCB/EMS Shops
Driving Innovation: Mastering Panel Warpage
It’s Only Common Sense: Sales Strategies for a Virtual World
Long-Term Thermal Reliability of PCB Materials
May 13, 2016 | E. McDermott, Ph.D., B. McGrath, and C. Harrington, Amphenol Printed Circuit Board TechnologyEstimated reading time: 1 minute
Abstract
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at Amphenol Printed Circuit Board Technology in Nashua, NH. The intent of this thermal aging testing is to establish longterm reliability data for PWB materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions.
Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown/degradation of the composite PCB material and mechanical structure over time and temperature for mission critical applications.
Thermal aging testing consisted of three phases.
- Phase I: 500-hour pre-screen at four fixed temperatures following IEEE98 A.1 and UL746B 20A (completed)
- Phase II: Short-term aging for 1000 hours at four revised fixed temperatures. Plated through-hole reliability testing using IST and HATS was also completed
- Phase III: Long-term aging for 25,000 hours at five revised fixed temperatures
This paper will discuss results of this testing to date.
Introduction
The objective of this testing is to establish the electrical strength-temperature Arrhenius curve (temperature life curve) for materials used in PWB for applications that exceed the typical 5,000 hour end of life test defined in UL Standard UL746B. The test methodology presented in this report generates data representing 25,000 hours of operational life.
Editor's Note: This article originally appeared in the April 2016 issue of The PCB Magazine.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.