-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
NEO Tech to Exhibit Substrate Capabilities and Microelectronic Assembly at IEEE Microwave Symposium
May 19, 2016 | NEO TechEstimated reading time: 1 minute
NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announces that it will showcase its high-reliability substrate and microelectronic assembly capabilities in booth 2143 at the 2016 IEEE International Microwave Symposium IMS 2016, which is schedule to take place from May 24-26 at the Moscone Center in San Francisco.
NEO Tech is North America’s leading manufacturer of quality low-temperature co-fired ceramic (LTCC) and high-temperature co-fired (HTCC) substrates and packages. These fabrication technologies provide unique solutions for high interconnect density, compact networks and high-frequency applications. Additionally, the company will discuss its microelectronics assembly services, which include package assembly, sealing and testing. With more than 40 years of experience in high-reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembly services provider.
During the symposium, NEO Tech will feature a range of its LTCC, HTCC and hybrid substrates and microelectronics packaging technologies:
- Ceramic Substrate manufacturing: thick film, ECP thick film, BeO substrates, plating and HTCC/LTCC board fabrication.
- LTCC systems: DuPont 951, 9K7, and 943; Ferro A6M, A6S, and L8; and gold, silver and mixed metal systems
- HTCC systems: multiple AlN tape systems and thermal conductivity >150 W/mK, Tungsten metallization electro-less plated with Ni-Au
- Innovative AUTOLINE to economically produce complex RF microelectronic packages
The company’s microelectronics facilities produce products and assemblies for a wide variety of OEMs in medical, telecommunications, and defense markets. The microelectronic industry faces the challenge of controlling costs and risk while ensuring reliability, and the company has thrived by offering customers an unmatched understanding of materials, production equipment, standardized processes, and defect-elimination approaches.
For more information about NEO Tech and/or the products and services that will be highlighted during the IMS2016 IEEE MTT-S International Microwave Symposium, visit the company’s website at www.NEOTech.com.