-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Orange Co. DC Chapter Meeting: PCB Cost Adders
June 1, 2016 | IPC Designers Council, Orange Co. ChapterEstimated reading time: 1 minute
The Orange County Chapter of the IPC Designers Council will hold a "Lunch 'n' Learn" meeting on Wednesday, June 15 in Irvine, California. Guest speaker Julie Ellis of TTM Technologies will focus on PCB cost-driving factors that should be considered early in the design phase to save your company money.
A designer is faced with many challenges when planning your layout to achieve a balance of performance, quality and reliability versus cost. In this presentation, Julie Ellis of TTM Technologies will discuss the many factors that contribute to cost and explore the trade-off considerations for design optimization.
She will explore panel utilization, layer count, material selection, via structure choices, via-filling options, the impact of various sequential laminations, plating processes, surface finishes, scoring, milling and back drilling. Attendees will learn various rules of thumb to help you make better choices for mitigating the cost of the boards you design.
Reserve a spot on your calendar on Wednesday, June 15 from 11:30 am to 1:30 pm for this educational “Lunch ‘n Learn” meeting event.
Date: Wednesday June 15, 2016
Time: 11:30 am - 1:30 pm
Where: Harvard Athletic Park multi-purpose room, Irvine, California
Please RSVP no later than noon on Tuesday, June 14, 2016
There are two ways to RSVP:
- Click here to RSVP
- Or email your RSVP to terri_kleekamp@mentor.com.
Location
Harvard Athletic Park
14701 Harvard Ave.
Irvine, California 92606
(The multi-purpose room is at the SOUTH end of the athletic fields)
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
03/14/2025 | Evelyn Cui, IPC AsiaIn Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.