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IPC Standards Committee Reports, Part 2 – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High FrequencyJune 6, 2016 | IPC
Estimated reading time: 5 minutes
These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.
Assembly and Joining
The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at the 2016 Fall Standards Meetings in September.
The 5-21A Component mounting subcommittee met to discuss the update of the Guidelines for Printed Board Component Mounting. The new document, IPC-7070 will be created by combining parts of IPC-770, IPC-7351B, IPC-7093 and IPC-7095. The goal is to gather all the component information into one document to make it more user friendly.
The 5-21f Ball Grid Array Task Group continued its review of the D revision of IPC-7095, Design and Assembly Process Implementation for BGAs. The task group identified several areas to be updated or added, including column grid arrays and solder column assembly, addressing 0.3-mm and variable pitches and supply chain issues.
The 5-21g Flip Chip Mounting Task Group met to solicit feedback on topics which need to be updated or added in IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. Based on the number of significant changes requested by industry, the group will determine if IPC-7094 requires a full revision or an amendment. Topics under consideration include wafer-level fan-in/fan-out processes, very fine pitches and high I/O variations.
The 5-21h Bottom Termination Components Task Group reviewed proposed new content and content updates for the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components. The group has identified several needs to bring the document up to current technology, including addressing low-temperature alloys, adding pictures of latest-technology BTCs, discussing 1-mm to 4-mm BTCs and managing supply chain issues.
The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. For the first time, the group also met at the same time with the Task Groups working on IPC-A-610, Acceptability for Electronic Assemblies and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies to resolve differences between the three documents addressing the same criteria.
The 5-22ad Requirements for Military Systems Work Group continued a discussion on content to address hardware contracted by the U.S. Department of Defense and used in military systems. They previously discussed a separate addendum, however during this meeting, they took action to review the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies. They are considering a joint effort with that Task Group.
The 5-22as Task Group discussed review comments from the Final Industry Review of the addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.
The 5-22h Thermal Profiling Guide Task Group met to review final document needs for the task group to distribute the working draft of IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) for comments. The task group plans to publish IPC-7530A by the end of the year. This will be the document’s first revision since its publication in 2001.
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Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Dynamic Grid has ordered a Hentec Industries/RPS Valence 3508 selective soldering system.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on March 7 at Sweeney Barn in Manassas, Virginia.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.