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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017July 1, 2016 | IPC
Estimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.
The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:
A 200-400 word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.
Technical conference paper abstracts are due July 8, 2016 and course proposals are due August 5, 2016. To submit an abstract or course proposal, click here.
NEOTech Launches World-Class NPI and Electronics Manufacturing Center of Excellence in Silicon Valley, Northern CA02/20/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the upcoming launch of a state-of-the-art New Product Introduction (NPI) and electronics manufacturing center of excellence at its Fremont, CA facility.
It’s easy to get distracted in an election year. A constant stream of polls, primaries, and political prognostications will surely dominate the media cycle. Elections are important, but they should not distract the 118th Congress from the important work of securing our fragile supply chains and rebuilding microelectronics manufacturing capacity on our own shores.
IPC’s efforts in government relations and advocacy have been pivotal in getting legislation like the CHIPS Act passed. In February, IPC President and CEO Dr. John W. Mitchell was back in Washington, D.C., representing our industry in a meeting convened by the U.S. Department of Commerce, where he discussed workforce issues in our industry and how to ensure that our businesses have the workforce they need. In this audio interview, he reviews his concerns and solutions on workforce development.
Sentiment among electronics manufacturers remains positive, despite minor setbacks during January, according to IPC’s February Sentiment of the Global Electronics Manufacturing Supply Chain Report.
The global semiconductor manufacturing industry recovery is taking hold with electronics and IC sales increasing in the final quarter of 2023 and more growth projected for 2024, SEMI announced in its fourth quarter 2023 publication of the Semiconductor Manufacturing Monitor (SMM) report, prepared in partnership with TechInsights.