Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
IPC Seeks Abstracts for 14th Electronic Circuits World Convention
July 8, 2016 | IPCEstimated reading time: 1 minute
Call for Papers From IPC Members
Now in its 39th year, the 14th Electronic Circuits World Convention (ECWC) will be held at the Korea International Exhibition & Convention Center (KINTEX) in Goyang City, South Korea from April 25 to 27, 2017. ECWC will be held along with the 2017 KPCA Show hosted by Korea Printed Circuits Association (KPCA).
This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government. It will provide a forum to exchange ideas and to share recent developments in various fields of electronic interconnection and to foster networking and collaboration.
Each WECC member is asked to contribute speakers from specific geopolitical areas to participate in the 14th ECWC. IPC has been asked to solicit abstracts from all members.
Submit your paper or poster abstract no later than September 30, 2016.
IPC is in search of abstracts on topics in the areas of Management and Technology for electronics interconnection, including but not limited to:
Management
- Market Trends and Outlook
- Global or Regional Market of PCB, materials, equipment, packaging, assembly and end products
- Supply Chain Management
- Inventory management, contact electronic manufacturing services, outsourcing, supply chain collaboration and supply chain risk management
- Standards, Certification and Qualifications
- IEC/ISO, UL, third-party quality assessment, standard and product certification
- Environment, Health and Safety
- Environmental registration, halogen-free, lead-free, incorporating green technology
- Business Strategy
- New product/technology introduction, aligning business with academia, surviving in shifting markets and geopolitical areas
Technology
- New Materials and Components
- Design and Data Transfer
- Test and Reliability
- PCB Processes, Chemical and Physical
- HDI/Fine Circuit Fabrication, Processes and Equipment
- Flexible Circuit Materials, Design and Applications
- Technologies for Wearables, Internet of Things, Automotive, High-Power, High-Speed, LED and Energy Harvesting
- Latest in Packaging, Substrate Technologies, 2.5/3D and Embedded Devices
- SMT and Assembly
- Printed Electronics
Important dates
- Opening of abstract submission June 29, 2016
- Abstract submission deadline September 30, 2016
- Notification of Abstract acceptance October 31, 2016
- Full paper submission deadline February 28, 2017
- Early Registration deadline March 18, 2017
Contact
For questions about submitting an abstract to IPC for the 14th ECWC, email Chris Jorgensen.
For more information about the 14th ECWC, email Dr. Tim Lee, ECWC 14 Secretariat.
World Electronic Circuits Council Members
- China Printed Circuit Association (CPCA)
- European Institute of Printed Circuits (EIPC)
- Hong Kong Printed Circuit Association (HKPCA)
- Indian Printed Circuit Association (IPCA)
- IPC — Association Connecting Electronics Industries
- Japan Electronics Packaging and Circuits Association (JPCA)
- Korea Printed Circuit Association (KPCA)
- Taiwan Printed Circuit Association (TPCA)
Share on:
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
03/14/2025 | Evelyn Cui, IPC AsiaIn Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.