John Mitchell, IPC president and CEO, wants to make sure that your questions about legislation affecting our industry are answered, and your concerns are addressed.
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Estimated reading time: 1 minute
John Mitchell, IPC president and CEO, wants to make sure that your questions about legislation affecting our industry are answered, and your concerns are addressed.
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