-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Releases Schedule of Standards Development Meetings
August 3, 2016 | IPCEstimated reading time: Less than a minute
IPC—The Association Connecting Electronics Industries is inviting the industry to join its Standards Development Meetings, which will be held from September 24–30, 2016.
Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by
Attending IPC standards development committee meetings offer attendees opportunities to contribute to the industry standards and guidelines that companies, customers, suppliers and competitors rely on.
IPC Standard Development Committees cover a range of topics, including:
- Assembly & Joining
- Assembly Equipment
- Base Materials
- Cleaning & Coating
- Electronic Documentation Technology
- Electronic Product Data Description
- Embedded Devices
- Environment, Health and Safety
- Fabrication Processes
- Flexible and Rigid-Flex Printed Boards
- High Speed/High Frequency Interconnections
- Management
- Packaged Electronic Components
- Printed Board Design Technology
- Printed Electronics
- Process Control
- Product Assurance
- Product Reliability
- Rigid Printed Boards
- Terms and Definitions
- Testing
For more information or to register, click here.
Suggested Items
Jabil Recognizes Koh Young with the 2024 Best Strategic Supplier Award
12/10/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been honored with the 2024 Jabil Best Strategic Supplier Award.
SEMICON Japan 2024 Opens Tomorrow to Highlight Smart Applications Powered by Semiconductor Technology
12/10/2024 | SEMISEMICON Japan, the region’s premier microelectronics industry conference and exhibition, opens tomorrow at Tokyo Big Sight. With more than 1,000 exhibitors from 35 regions, the conference gathers leaders from across the microelectronics manufacturing supply chain from December 11-13. SEMICON Japan 2024.
Incap Teams Reflect on their Visit to Electronica 2024
12/09/2024 | IncapThe Electronica fair, held biennially in Munich, Germany, is one of the world’s largest trade shows for the electronics industry, bringing together innovators, suppliers, and key players to network and discuss the latest trends.
Confidee Joins Newly Founded Space Denmark
12/06/2024 | CONFIDEEConfidee is proud to announce its approval as a member of Space Denmark, an organization dedicated to uniting and strengthening the Danish Space Industry.
2024 IPC K-FEST: Shaping the Future of the Electronics Industry
12/06/2024 | IPCIPC K-FEST 2024, the 2nd annual IPC Korea Festival of Electronics Standards and Technology, was held in Seoul on October 29. The focus of this year’s event centered on the integration of Korea's technological leadership with international standards development.