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IPC Announces Development of Press-fit Pin Standard for Automotive RequirementsAugust 23, 2016 | IPC
Estimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has announced plans to start the development of a new standard intended to cover the qualifications and acceptance requirements for press-fit pin technology that includes the reliability needs for automotive and other industries, such as aerospace.
This new standard is highly anticipated, as there is currently not a specific standard to support press-fit pin automotive requirements and other high-reliability applications. The yet to be named standard is expected to be released late 2017. The IPC standards development process will bring together collaboration between design and assembly task groups as well as all considerations and criteria for applicable documents of both design and assembly.
“This newly proposed standard is exciting for multiple reasons. First, it is a document specifically requested by the European automotive electronics industry and is further evidence that European stakeholders are embracing IPC’s efforts to engage them in IPC’s global standardization process,” said Dave Bergman, IPC vice president of standards and training. “Additionally, it will help to close a technology hole in IPC’s standardization tree by adding a fresh look at the use of press-fit pin technology in electronic hardware.”
This document will be IPC’s second significant standard developed to support the rapidly growing automotive electronics industry. The development of standards continues to be one of the IPC’s core value propositions and the automotive electronics industry is one of the key verticals in Europe.
“IPC views this press-fit pin standard activity as an important step in our mission to deliver value to our growing membership in Europe and to help make them more financially successful,” added Sanjay Huprikar, IPC vice president of member success. “As we continue to utilize our European members as strong voices and champions in the development of our educational offerings and events, we are encouraging these members to get more involved in developing standards for the industry.”
For more information on IPC standards, click here.
I just finished counting the percentage of times in which artificial intelligence/machine learning/data analytics topics appeared in the I-Connect007 news this week. What do you think the percentage is? AI has moved well beyond a technical term; heck, it has clearly also eclipsed catch-phrase status. It seems a foregone conclusion that AI applications will be inserting themselves into manufacturing just as they are appearing in our handheld devices. Speaking of handhelds, that market seems to be growing as well. This week’s five must-reads include smartphone market data, telecom infrastructure development, a new white paper on the influence of data analytics, a report on the European market, and the launch of a new podcast series on PCB 3.0, a new design methodology.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.