Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Case Study: Flex Smart Factory at Fuyong
August 24, 2016 | Jeff Li, et al.*, FlexEstimated reading time: 10 minutes
Abstract
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make factories smarter, safer and more environmentally sustainable. Get Manufacturing Functions connected with Real Time Information Systems to enable a predictive approach in all functions to serve Higher Reliability and HMLV (high-mix low-volume) services solutions.
In this paper, we will share our experience with a current project called "Smart Factory"[1], especially for Phase I of the project. Our objective is that Get Manufacturing Functions connected with real time information systems enable predictive approaches in all functions to serve Higher Reliability and High-Mix Low-Volume (HMLV) services solutions.
Through establishment of a KOI (Key Operation Indicator) structure with visualization eDashboard, we have realized the alarming abnormalities in real time and failure analysis mining from top symptoms to bottom root cause with processes correlation.
Collecting the parameters of machine and process data in real time automatically makes the connection between machines and processes to get higher efficiency for quality and production monitoring and control. Color coding for different level abnormalities gives visualization control. The real time data captured from machines and process is loaded into a central factory SPC (Statistical Process Control) system that makes predictions for taking action before failures. Real time data was sent to mobile phones to improve communication between operators and machines which has increased production efficiency.
We have seen significant achievements for the Phase I: Average yield (Final Pass Yield) increased from 99.1 % to 99.44%, NDF (No Defect Found) decreased from 2% to 0.9%, and also have SPC to be more predictive. Prevention is always better than detection[2].
Introduction
The Smart Factory project has been ongoing for more than six months. In March 2015, top management set a high goal for our factory's future: achieve Smart Factory. "Develop the company site to be a SMART factory with High-Mix Low-Volume (HMLV) service with flexibility, quality, consistency, cost effectiveness and profitability, creating value that increases customer competitiveness for win-win solutions."
A Smart Factory Implement Team was setup to start the Smart Factory journey. In this paper, experiences will be shared on this journey.
The SMART FACTORY with HMLV Services Solutions has a visualization control tower with the company site cloud which links to Smart Office, Smart Operation, Smart Supply Chain, and External Cloud which are shown in Figure 1.
Figure 1: SMART FACTORY with HMLV Services Solutions
The objective was to get Manufacturing Functions connected with real time information system to enable a predictive approach in all functions to serve higher reliability and high-mix low-volume services solutions.
What does SMART stand for? Below are our definitions.
- Strategy with Standardization
- Manufacturing with LEAN to optimize and remove WASTE
- Automation in Software and Hardware solutions
- Real Time Data control limits monitoring and triggering
- Total Quality Management with SPC to enable predictive approach
The past six months, the Smart Factory approach has been called the 5C Get Connect Elements.
- Connection (Sensors and Networks),
- Cloud (Computing data on demand)
- Content / Context (Correlation)
- Community (Corporate Social and Environmental Responsibility and Partnership Collaboration)
- Customization (HMLV)
The intelligent machine to machine or process to process setup has to provide self-optimization, self-configuration, self-diagnosis, self-learning and ability to connect with a real time information system to provide self-awareness and triggering capabilities.
The Smart Operations has a Technical Architecture and Operation Architecture that is shown in Figure 2.
The team studied the current status of the environment, process, data collection and analysis as well as yields to develop the Technical Architecture and Operation Architecture for the project.
Physical Device Layer, Connection Layer, Data Acquisition Layer, Data Storage Layer, Algorithm Layer, and Control Tower Layer are for the Technical Architecture which are shown with a blue color; and Decision Layer, Operation Layer, Execution Layer, and Service Layer are for Operation Architecture are shown with a yellow color. All of these layers are connected in real time.
Figure 2: Smart Operations - Technical Architecture and Operation Architectures
Page 1 of 4
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.