-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Insulet Extends Manufacturing Agreement with Flextronics
September 6, 2016 | Stephen Las Marias, I-Connect007Estimated reading time: Less than a minute
Insulet Corp. recently entered into a materials supplier agreement with Flextronics Medical Sales and Marketing Ltd. In a Securities and Exchange Commission (SEC) filing by Insulet, under the new agreement, which has an initial term of five years, Flextronics will continue to produce and manufacture Insulet's proprietary Omnipod Insulin Management System, as well as its drug delivery devices and personal diabetes managers (PDMs).
Flextronics will continue to manufacture the devices at its subsidiary's facility in China. Under the new agreement, Flextronics will supply Insulet with devices in accordance with rolling 12-month forecast and delivery schedules provided by the company, and the company will continue to purchase product on pricing and terms agreed by the parties.
The new agreement supersedes all prior agreements between Insulet and Flextronics, including the prior master supply and manufacturing services agreements entered into by the parties.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
3D Printing and Additive Manufacturing in PCBA
05/28/2018 | Zohair Mehkri, David Geiger, Anwar Mohammed, and Murad Kurwa, FlexThere are several materials that are available for 3D printing for various engineering uses. Various vendors offer over hundreds of different materials that are either specific to an application or to a specific desired characteristic. For this study, eight materials that are regularly used for engineering applications were evaluated and characterized to determine which can be used in PCB processes.
Flex Schedules Release of 4Q FY2018 Earnings
04/03/2018 | FlexFlex will hold a conference call to discuss its fourth quarter and fiscal year end 2018 results on Thursday, April 26, 2018 at 2:00 p.m. Pacific Time (5:00 p.m. Eastern Time).
Flex Reports Q4 and FY 2017 Results
05/01/2017 | FlexEMS firm Flex has announced results for its fourth quarter and fiscal year ended March 31, 2017. The company has reported quarterly revenue of $5.9 billion, increasing 2% year-over-year and at high end of revenue guidance.
Case Study: Flex Smart Factory at Fuyong
08/24/2016 | Jeff Li, et al.*, FlexThis paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.
Overview Miniaturization on Large Form Factor PCBA
02/24/2016 | D. Geiger, A. Mohammed, M. Kurwa, AEG, Flextronics International Inc.Many of the miniaturization technologies were developed for the consumer market, targeted mainly at the smart phone. Many designers in other areas such as medical and telecom are looking at ways to miniaturize the product or increase the functional density. This article explores some of the common miniaturization technologies and their application to larger form factor boards.