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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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EIPC Speednews: News from the European PCB Industry
September 9, 2016 | EIPCEstimated reading time: Less than a minute

- Still possible to register due to larger venue reservation! Register now for the EIPC workshop at Snowdome on September 22
- New Half Day Working Group Meeting for EMS Manufacturers
- Camtek reorganises its digital printing activities
- Ventec International doubles IMS material manufacturing capacity with $2 million equipment investment
- Future Horizons' IFS2016 Mid-Term Semiconductor Market Outlook & Forecast
- Knowles UK move to new premises
- ICT Evening Seminar at the Newtown House Hotel, Hayling Island 20th September
- Only 4 days left!!
- Leak: iPhone 7 will solve two of the three biggest problems with iPhones
- News from IPC
Suggested Items
Dixon, Inventec Form JV for PC Manufacturing in India
05/05/2025 | DixonDixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
03/07/2025 | VentecVentec International Group is delighted to announce the appointment of Chris Mundy as Commercial Director for EMEA & Americas.