-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Frontline Announces InStack Design
September 13, 2016 | Frontline PCB SolutionsEstimated reading time: 1 minute
Frontline PCB Solutions, an Orbotech-Mentor Graphics company, today announced the launch of InStack Design, an industry-proven solution for designing complex stackups in minutes, taking all fabrication and SI constraints into account and enabling seamless electronic collaboration with board fabricators.
“Efficient designer-fabricator collaboration is essential in a world where time to market is central to the success of your business,” said Yovav Sameah, president of Frontline PCB Solutions. “Our parent company, Mentor Graphics, has a profound understanding of designer needs. Thanks to the strong cooperation between the two companies it seems logical to bring Frontline’s industry-proven PCB design planning tools to designers, allowing them to concentrate on functionality and signal integrity. Designers can now plan boards using the same tools as fabricators, shortening lead-time by eliminating lengthy exchanges with manufacturers. Designing stackups with the right tradeoffs will dramatically reduce time to market and improve product quality.”
InStack Design is a comprehensive solution for flex and rigid-flex stackups, integrating suppliers, materials, and processes to ensure manufacturability, seamless integration of design and fabrication, and accurate stackup design. Using standard industry materials or material libraries provided by the PCB suppliers themselves, designers can model and verify thickness, impedance, and losses quickly and precisely, even for the most complex multi-zone structures. InStack Design accelerates manufacturing and meets board requirements to produce more efficient, higher quality PCBs.
About Frontline PCB Solutions
Frontline is an Orbotech and Mentor Graphics software company, bringing together the power, knowledge, and stability of two world leaders and creating smart, future-oriented technologies and solutions for the PCB industry. Frontline has a strong track record of success, with more than 20 years’ experience and over 10,000 installations worldwide. Frontline offers its customers a complete preproduction solution, from design to manufacturing, and builds long-term partnerships with customers, offering ongoing training and consulting.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Simplifying Software Integration for Every Factory
10/22/2025 | Nolan Johnson, SMT007 MagazineAs a leading provider of factory digitalization solutions for electronics manufacturers, Cogiscan is at the heart of the software integration process. Davina McDonnell, director of marketing and product management, discusses how Cogiscan ensures that customers are ready to integrate and what it looks for to ensure a quick and appropriate installation.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.