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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Global Technology
Column from: Eran Navick
Eran Navick has been in the PCB business for over 25 years and held key positions in PCB companies, including as a PCB designer and applications engineer. During his career, Mr. Navick has worked with PCB companies all around the world and has a very strong knowledge of PCB technologies globally. He is currently the CEO of FineLine USA with responsibilities for all of Fineline Global’s North American operations.