Beyond Design: The Fundamental Structure of Spectral Integrity
Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Global Technology
Column from: Eran Navick
Eran Navick has been in the PCB business for over 25 years and held key positions in PCB companies, including as a PCB designer and applications engineer. During his career, Mr. Navick has worked with PCB companies all around the world and has a very strong knowledge of PCB technologies globally. He is currently the CEO of FineLine USA with responsibilities for all of Fineline Global’s North American operations.
March 05, 2020
Global Technology: The Importance of Fine Lines
As the electronics “must-have” product invasion is finding its way into all parts of our lives, we are bombarded by advertisements for smaller cellphones and electronic products that do more and more. Eran Navick explains how the one thing they all require is smaller and smaller electronic devices and printed circuits to put in these devices.February 20, 2020
Global Technology: The Importance of Laminate CTE in PCB Design
All material expands and contracts with temperature change, which is called the coefficient of thermal expansion (CTE). Eran Navick explains where and how the laminate expands effects the operation of the printed circuit in different ways.January 23, 2020
Global Technology: Assembling High-current, Heavy Copper PCBs
Many designers and assemblers are not familiar with high-current, heavy copper PCBs, which can take much longer to plate than typical boards. In his debut column, Eran Navick explains the details of heavy copper boards and how designers can better work with them.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in