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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Digital Transformation
Column from: Team Siemens
David Wiens:
Over the past 35+ years, David Wiens has held various engineering, marketing and management positions within the EDA industry. His focus areas have included advanced packaging, high-speed design, routing technology and integrated systems design. He is currently the product manager for the Xpedition Enterprise portfolio of products for electronics systems design. He holds a B.S. in computer science degree from the University of Kansas.
AJ Incorvaia is senior vice president, Electronic Board Systems Division, Siemens Digital Industries Software.
Steph Chavez is senior printed circuit engineer with three decades’ experience. In his current role as a senior product marketing manager with Siemens EDA, his focus is on developing methodologies that assist customers in adopting a strategy for resilience and integrating the design-to-source intelligence insights from supply frame into design for resilience. He is an IPC Certified Master Instructor Trainer (MIT) for PCB design, an IPC Certified Advanced PCB Designer (CID+), and a Certified Printed Circuit Designer (CPCD). He is chairman of the Printed Circuit Engineering Association (PCEA).