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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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SMT Trends & Technologies
Column from: Eric Klaver
Eric Klaver was born in Rosemere, Quebec, and via Oklahoma, he moved with his family to Holland at the age of 12. After finishing school, he became a radio officer for the Merchant Navy. After studying computer science, where he learned how to program and design ICs, Klaver enjoyed a career at Philips. This was followed by a move to Assembleon in 1998.