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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Marcy's Musings
Column from: Marcy LaRont
Marcy LaRont is the managing editor of PCB007 Magazine. Having started her career in the printed circuit board industry in 1993, Marcy was fortunate to work across many facets of the PCB business, including environmental compliance, procurement, production control, and sales, before coming over to the publishing side for the first time in 2007. Marcy lived in Taiwan and Hong Kong for several years and has also enjoyed a career in the nonprofit sector focusing on business development and organizational management. A lover of the written word and a staunch believer in the importance of communication to propel us forward, Marcy happily returns to the industry that raised her and is dedicated to making PCB007 the top online source of news and information for all things related to printed circuit boards.