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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Global PCB Connections
Column from: Jerome Larez
Jerome Larez is a field application engineer for CEE PCB. He has 20 years of experiences in PCB fabrication, including manufacturing (all process areas but specializing in wet process), planning, sales, applications engineering (DFM analysis, developing process flows for FPCs and PCBS, defect characterizations), and management.
He is the former president of SMTA-Puget Sound Chapter, and former treasurer for IPC Designers Council-Cascades Chapter.