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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Global PCB Connections
Column from: Jerome Larez
Jerome Larez is a field application engineer for CEE PCB. He has 20 years of experiences in PCB fabrication, including manufacturing (all process areas but specializing in wet process), planning, sales, applications engineering (DFM analysis, developing process flows for FPCs and PCBS, defect characterizations), and management.
He is the former president of SMTA-Puget Sound Chapter, and former treasurer for IPC Designers Council-Cascades Chapter.