-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Leo Lambert Discusses EPTAC’s Evolving Mission
November 7, 2016 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

This month we’ve been dealing with challenges related to being a great manager and a great leader. One of the biggest problems a manager faces is training—getting employees trained, and keeping them current on constantly changing technologies. I asked Leo Lambert, VP and CTO of EPTAC, what his thoughts were on the subject of leadership, and more specifically, what strategies EPTAC embraces with regard to training—both initial and ongoing.
Andy Shaughnessy: Leo, please give us a quick background on EPTAC and the training you provide.
Leo Lambert: EPTAC is a certified IPC training center, and we train to all the IPC programs, including IPC-A-600, IPC-A-610, J-STD-001, WHMA/IPC-A-620, IPC-7711/7721, and IPC-6012. We hold these classes all over the country and in our local facility in Manchester, New Hampshire. We are the largest training center supplying IPC training to the industry.
We offer and sell training materials to support our customers who train their own personnel and conduct webinars on a monthly basis, discussing current topics within our industry. We answer customers’ questions in our Solder Tips section and believe this Q&A is really helpful to the industry. Our Ask Helena & Leo section allows anyone to ask questions related to electronic manufacturing and more. We also provide news about the latest things happening within the industry and within EPTAC itself.
Shaughnessy: Have your training methods evolved over time?
Lambert: Our offerings to the industry include a manual soldering program, along with an advance manual soldering program dealing with 0402, 0201 and 01005 component sizes. This program is modified at the request of our customers to fit their needs.
We also have incorporated additional workmanship programs to the IPC 610 and 620 programs where we teach the students how to inspect the product and physically build a cable with the appropriate crimps and strip lengths.
Additionally, we’ve developed workshops designed for engineers and supervisors to provide them with a quick look at the standards, so that they can understand the content and intent of the programs.
Shaughnessy: How has the curriculum itself changed?
Lambert: The curriculum is always changing based upon the existing and changing technology in tooling, materials, products and documentation. We don’t normally focus on the computer skills necessary to run the equipment, but from what I’ve seen on the manufacturing floor, the skill levels needed are to troubleshoot the equipment when the unit malfunctions or stops. The operators are trained to read the screens, selecting the various programs to be run depending upon the product, and to get in touch with maintenance if a major deviation occurs.
To read this entire article, which appeared in the October 2016 issue of The PCB Design Magazine, click here.
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.