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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production
March 31, 2017 | Real Time with...IPCEstimated reading time: Less than a minute

Flying-probe testing progresses into high-volume, high-throughput HDI sector with the introduction of a fully-automated dual-shuttle machine specifically built to fulfill a particular industry requirement. Klaus Koziol, atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latest innovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.
Suggested Items
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.
IPC Hall of Fame Spotlight Series: Highlighting Bob Neves
06/11/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
Rohde & Schwarz Satellite Industry Day 2025: Connecting the World with New Space and 5G NTN Technologies
05/27/2025 | Rohde & SchwarzAfter four successful online events with over 1000 participants, Rohde & Schwarz is hosting its fifth Satellite Industry Day on June 3, 2025, on-site at its Munich campus. Rohde & Schwarz test and measurement experts and partners from the industry will present topics from 5G Non-Terresterial Network (NTN) and satellite testing to monitoring and regulatory issues. During breaks participants can experience cutting-edge test and measurement solutions.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.