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Ventec International Appoints Kyle Pattie as Account Manager, Eastern USA
April 24, 2017 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group has appointed Kyle Pattie account manager for the US Eastern region, selling and supporting all product lines to help the company further develop its presence in the region.
Pattie is a graduate from the University of Delaware with a Bachelors of Arts in International Relations and a minor in history. His conversational level of Mandarin Chinese was a great advantage during his internships at Ventec's corporate headquarters in Suzhou, China, Ventec's manufacturing facility in Jiangyin, and at the US regional headquarters in Amesbury, Massachusetts. Kyle recently completed a further internship at Tokio Marine HCC.
Pattie says, "My intensive internships have given me very important, transferable skills and, in particular, an in-depth knowledge of the Ventec product range – an essential foundation for my new role in supporting all sales activities in the Eastern region of the USA."
Mark Goodwin, COO Ventec EMEA & USA, added, “I have every confidence that the knowledge Kyle brings to the role, coupled with his winning mentality and personality, will greatly benefit our customers. Ventec prides itself on the strength of its people and I am pleased to welcome Kyle to the Ventec team."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
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04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
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ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
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Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.