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Ventec International Appoints Kyle Pattie as Account Manager, Eastern USAApril 24, 2017 | Ventec International Group
Estimated reading time: 1 minute
Ventec International Group has appointed Kyle Pattie account manager for the US Eastern region, selling and supporting all product lines to help the company further develop its presence in the region.
Pattie is a graduate from the University of Delaware with a Bachelors of Arts in International Relations and a minor in history. His conversational level of Mandarin Chinese was a great advantage during his internships at Ventec's corporate headquarters in Suzhou, China, Ventec's manufacturing facility in Jiangyin, and at the US regional headquarters in Amesbury, Massachusetts. Kyle recently completed a further internship at Tokio Marine HCC.
Pattie says, "My intensive internships have given me very important, transferable skills and, in particular, an in-depth knowledge of the Ventec product range – an essential foundation for my new role in supporting all sales activities in the Eastern region of the USA."
Mark Goodwin, COO Ventec EMEA & USA, added, “I have every confidence that the knowledge Kyle brings to the role, coupled with his winning mentality and personality, will greatly benefit our customers. Ventec prides itself on the strength of its people and I am pleased to welcome Kyle to the Ventec team."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.