-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Video from productronica 2017: Nordson ASYMTEK Highlights Bulk Dispensing Technology
November 16, 2017 | I-Connect007Estimated reading time: Less than a minute

Nordson ASYMTEK is known for microdispensing. At this week’s productronica, one of the highlights from the company is the new Helios SD960 bulk and two-component dispensing system. Almar Thewissen, program manager for Industrial Applications, EMEA, at Nordson, discusses its applications with I-Connect007 Technical Editor Pete Starkey.
Watch The Interview Here:
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
MVTec, Siemens Expand Technological Cooperation
06/12/2025 | MVTecMVTec Software GmbH and Siemens are expanding their technological cooperation in the field of industrial automation. To reinforce their increasingly close collaboration, Siemens joined the MVTec Technology Partner Program in May 2025.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
ACCM Joins Polar’s Speedstack Material Partner Program
06/10/2025 | Polar InstrumentsAdvance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.