-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Power Integrity by Example eBook Available for Download
February 19, 2018 | I-Connect007Estimated reading time: 1 minute

Released in November, The Printed Circuit Designer’s Guide to… Power Integrity by Example micro eBook has been downloaded by hundreds of engineers and other readers interested in PCB design.
This book is part of I-Connect007’s ongoing series, The Printed Circuit Designer’s Guide to…, which is specifically dedicated to educating PCB designers, and serves as a valuable resource for people seeking the most relevant design information available. Written by Fadi Deek of Mentor, A Siemens Business, Power Integrity by Example complements Deek’s first design title, Signal Integrity by Example.
The power integrity book provides a thorough investigation of power distribution network performance. Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter. Readers will gain a better understanding of cause-effect relationships between varying factors and how to consider these when making design decisions.
Gene Garat, president of MossEDA, describes the book as having, “Just the right amount of technical content. It covers the basics of power integrity analysis in fewer than 40 pages. Engineers new to the field, as well as career veterans, can all benefit from this quick, well-illustrated read with plenty of examples.”
Download your free copy today! You can also view other titles in our full library.
Look for these other exciting titles in The Printed Circuit Designer’s Guide to… series:
- Thermal Management with Insulated Metal Substrates by Ventec International Group
- Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals by American Standard Circuits
- Secrets of High-Speed PCBs — Parts 1 & 2 by Polar Instruments
- Design for Manufacturing (DFM) by Altium
We hope you enjoy The Printed Circuit Designer’s Guide to… Power Integrity by Example.
For more information, contact:
Barb Hockaday
I-007eBooks
+1-916-365-1727 (GMT-8)
Suggested Items
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future
04/24/2025 |Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?
Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.