-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
June 13, 2025 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Customers will be able to accelerate the development of their industrial technology by leveraging Cadence’s industry-leading solutions, optimized for NVIDIA Grace Blackwell platforms. These innovative solutions include the Fidelity™ CFD Platform, the Spectre® X Simulator, the Voltus™ IC Power Integrity Solution, and the Innovus™ Implementation System, among others.
Europe’s industrial AI ecosystem will be able to leverage Cadence® solvers accelerated by NVIDIA Blackwell systems by up to 80X from the industrial AI cloud. Ascendance is using Cadence Fidelity computational fluid dynamics software and NVIDIA accelerated computing to design the future of aviation, achieving a 20X reduction in simulation runtimes.
In addition, the AI cloud will be built using the NVIDIA Omniverse Blueprint for AI factory design and operations, which leverages the Cadence Reality™ Digital Twin Platform to simulate and optimize the entire operation in a physically accurate virtual environment, enabling engineering teams to build smarter, more reliable facilities. This approach further ensures performance-driven data center design and drives peak operational efficiency.
“Cadence’s solutions, combined with NVIDIA AI infrastructure, are transforming the future of engineering design for the European ecosystem,” said Michael Jackson, corporate vice president and general manager of the System Design and Analysis Group at Cadence. “By making our solutions available on the NVIDIA industrial AI cloud, we’re empowering Europe’s leaders to design intelligent systems faster and with higher quality than ever before."
“The ability to simulate the physical world with extraordinary fidelity and speed is transforming engineering and design,” said Tim Costa, senior director, CUDA-X and CAE at NVIDIA. “With Cadence tools running on the world’s first industrial AI cloud, Europe’s engineers can invent, test and refine the future before it's built.”
Built on 10,000 NVIDIA Blackwell GPUs in NVIDIA DGX B200 systems and NVIDIA RTX Pro Servers, and running NVIDIA CUDA-X, and NVIDIA Omniverse accelerated workloads, this new AI cloud enables Europe’s industrial leaders to leverage Cadence solutions, accelerating applications for semiconductor and system design end markets, including automotive, energy infrastructure and manufacturing.
Cadence recently announced that it is transforming AI-accelerated simulation for multiple markets, including industrial AI, with its new Cadence Millennium™ M2000 Supercomputer. The Millennium M2000 Supercomputer combines industry-leading design software from Cadence and NVIDIA CUDA-X libraries with the NVIDIA Blackwell platform, including the NVIDIA GB200 NVL72 systems, to accelerate silicon, system and drug design.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Mouser Electronics Celebrates Its 2025 Best-in-Class Award Winners
10/01/2025 | BUSINESS WIREMouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is pleased to announce the 2025 recipients of the Mouser Best-in-Class Awards.
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..
Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric
09/25/2025 | BUSINESS WIRECadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.