NASA Seeks US Partners to Develop Reusable Systems to Land Astronauts on Moon
February 18, 2019 | NASAEstimated reading time: 2 minutes

As the next major step to return astronauts to the Moon under Space Policy Directive-1, NASA announced plans on December 13 to work with American companies to design and develop new reusable systems for astronauts to land on the lunar surface. The agency is planning to test new human-class landers on the Moon beginning in 2024, with the goal of sending crew to the surface in 2028.
Image Caption: Artist’s concept of a human landing system and its crew on the lunar surface with Earth near the horizon.
Through multi-phased lunar exploration partnerships, NASA is asking American companies to study the best approach to landing astronauts on the Moon and start the development as quickly as possible with current and future anticipated technologies.
“Building on our model in low-Earth orbit, we’ll expand our partnerships with industry and other nations to explore the Moon and advance our missions to farther destinations such as Mars, with America leading the way,” said NASA Administrator Jim Bridenstine. “When we send astronauts to the surface of the Moon in the next decade, it will be in a sustainable fashion.”
The agency’s leading approach to sending humans to the Moon is using a system of three separate elements that will provide transfer, landing, and safe return. A key aspect of this proposed approach is to use the Gateway for roundtrip journeys to and from the surface of the Moon.
Using the Gateway to land astronauts on the Moon allows the first building blocks for fully reusable lunar landers. Initially NASA expects two of the lander elements to be reusable and refueled by cargo ships carrying fuel from Earth to the Gateway. The agency is also working on technologies to make rocket propellants using water ice and regolith from the Moon. Once the ability to harness resources from the Moon for propellant becomes viable, NASA plans to refuel these elements with the Moon’s own resources. This process, known as in-situ resource utilization or ISRU, will make the third element also refuelable and reusable.
NASA published a formal request for proposals to an appendix of the second Next Space Technologies for Exploration Partnerships (NextSTEP-2) Broad Agency Announcement (BAA) on Feb. 7, and responses are due March 25.
According to the solicitation, NASA will fund industry-led development and flight demonstrations of lunar landers built for astronauts by supporting critical studies and risk reduction activities to advance technology requirements, tailor applicable standards, develop technology, and perform initial demonstrations by landing on the Moon.
When NASA again sends humans to the Moon, the surface will be buzzing with new research and robotic activity, and there will be more opportunities for discovery than ever before. Private sector innovation is key to these NASA missions, and the NextSTEP public-private partnership model is advancing capabilities for human spaceflight while stimulating commercial activities in space.
The President’s direction from Space Policy Directive-1 galvanizes NASA’s return to the Moon and builds on progress on the Space Launch System rocket and Orion spacecraft, efforts with commercial and international partners, and knowledge gained from current robotic presence at the Moon and Mars.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar InstrumentsTransmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.
Henniker Plasma Launches Stratus Turnkey Plasma Manufacturing Cell
08/13/2025 | Henniker PlasmaHenniker Plasma, a leading manufacturer of plasma treatment systems, proudly announces the launch of its Stratus Plasma Manufacturing Cell range — a fully integrated, turnkey solution that combines advanced atmospheric plasma surface treatment with robotic automation.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.