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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Publishes Second Annual Show & Tell Magazine—All About IPC APEX EXPO 2019
February 19, 2019 | I-Connect007Estimated reading time: Less than a minute
Welcome to the second annual Real Time with… IPC APEX EXPO 2019 Show & Tell Magazine.
This special publication is a supplement to our other monthly magazines and brings you exclusive, in-depth coverage of the recent event. These pages are packed with tons of great content including event photos, video interviews, attendees’ thoughts, reviews from our guest contributors and I-Connect007 editors, interviews with award winners and other industry experts, and coverage of the successful IPC STEM Student Outreach program. If that’s not enough, you will also enjoy our coverage of the Hand Soldering and Rework World Championship, the two executive forums, and all of the excitement around CFX.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Mexico’s Wire Harness Pivot Point
04/22/2026 | Nolan Johnson, SMT007 MagazineMexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.
EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
04/21/2026 | Alison James and Chris Mitchell, Global Electronics AssociationThe European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks
Women in Technology: Learning to Just Be Myself
04/21/2026 | Michelle Te, I-Connect007Approximately 100 women and a handful of men gathered for a Women in Electronics evening event at APEX EXPO. As I wandered among the tables before it started, I stopped to chat with several women all wearing purple and white polo shirts emblazoned with the TTM logo. It turns out they are part of TTM’s Women in Technology Group, so I sat down and invited them to share their thoughts on coming to the event and what it means to be part of the electronics industry.
SMTA Announces 2026 STAR Forum Technical Program
04/16/2026 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 6-7, 2026 in Olathe, Kansas, USA.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.