Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
The Shaughnessy Report: Solving the Data Package Puzzle
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Mentor Webinar April 11: How to Model Thermal Vias
April 2, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
In electronics product design, PCB thermal management that ensures adequate component cooling is important for reliability. Demands for compact designs and reduced costs drive a need for accurate and early evaluation of cooling options during design ideation phase.
Thermal vias offer opportunities to enhance heat dissipation away key components on a PCB. Register now for a new webinar on April 11, 2019, and learn how to model thermal vias quickly and accurately at different stages of PCB design.
Two live sessions are available April 11. Topics include:
- How thermal vias can assist in heat dissipation on a PCB
- How to model thermal vias during development; simple to explicit detailed approaches
- Methods applied to an example model of a component mounted on a PCB with thermal vias
To register, click here.
- Article: PCB thermal design in Automotive Display Clusters
- New Flotherm XT virtual lab: Try CAD-centric smart electronics cooling 30 day free trial
Incl. updated real world models (ADAS cameras + Drone quadcopter, IGBT calibration) and tutorials + videos - Video: Reducing thermal simulation time for PCBs using Substitute Layer Analysis
- Article: 6 Sigma methods applied to electronics cooling design
Share on:
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial TeamIn response to this week's news about new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain—the Strengthening Essential Manufacturing and Industrial (SEMI) Investment Act—IPC’s Richard Capetto, senior director of North American Government Relations, made the following statement.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in