5G Core Platforms Set to Generate $8 Billion
July 26, 2019 | ABI ResearchEstimated reading time: 3 minutes
Telecoms vendors and Mobile Service Providers (MSPs) are probing new revenue opportunities and business models that look beyond where the money is in the value chain, to where it will be in the years to come. An increased emphasis on software-centric networks like 5G, which favor services, is expected to usher in the next wave of growth in telecoms, finds global tech market advisory firm ABI Research. But the industry will only reap the benefits of advanced use cases such as ultra-reliable low-latency communications (uRLLC) and massive machine-type communications (mMTC) when they migrate wholesale to full 5G networks.
“The industry must realize that 5G is not just about radio and core network evolution,” says Don Alusha, Senior Analyst at ABI Research. “The introduction of 5G is almost certainly going to require investment in other parts of the ecosystem, like transport networks and cloud-based platforms. The supply side of telecoms, therefore, must accompany its 5G offering with a clear understanding of how 5G-specific use cases fit into the wider connectivity-centric telecoms ecosystem to unlock new commercial opportunities for the industry at large.”
At present, vendors are providing a converged solution where 4G functions can combine with 5G capability in the same product, but standalone 5G commercial offerings are bound to hit the market soon. Incumbent vendors (ZTE, Ericsson, Huawei, and Nokia) are expected to play a vital role in migrating the large number of existing 3G and 4G networks into 5G environments. Other vendors like Mavenir, Parallel Wireless, and Affirmed Networks will also offer complementary capabilities around virtualization and cloud technologies. Initial ABI Research estimates point to a market that is projected to start at a modest US$29 million in 2020, growing to US$8.4 billion in 2024, at a Compound Annual Growth Rate (CAGR) of 313%.
MSPs are pursuing different strategies to embrace 5G mainly focused on radio enhancements, but eventually, they must face the prospect of upgrading to full 5G functionality. The sentiment in the operator community varies. Some assert that they intend to wait for the ecosystem to reach a high degree of maturity, while some others are already pursuing trials aimed at a full-fledged 5G network. The transition to a 5G network is not a quick endeavor, but that should not preclude MSPs, and the industry at large, from taking a step now and accelerating investment down the line for a wholesale migration. Orange Spain and Telefonica, in collaboration with ZTE, are two telcos that have begun that migration with ‘full’ 5G trials.
“A utopian vision of a perfect migration path is just that: utopian. Pursuing the perfect 5G deployment path may not be the optimal way to realize the full benefits of 5G. MSPs’ adoption of 5G will vary in line with where they currently are from a technology perspective and business potential, and priorities from a commercial perspective. While each MSP will chart its own course, it is essential that they have a clear plan in place that captures some benefits now, but—and this is important—does not drift away from the goal of ultimately creating a large-scale commercial upswing,” Alusha concludes.
These findings are from ABI Research’s 5G Next-Generation Core and Service-Based Architecture technology analysis report. This report is part of the company’s 5G Core & Edge Networks research service, which includes research, data, and analyst insights. Based on extensive primary interviews, Technology Analysis reports present in-depth analysis on key market trends and factors for a specific technology.
About ABI Research
ABI Research provides strategic guidance for visionaries needing market foresight on the most compelling transformative technologies, which reshape workforces, identify holes in a market, create new business models and drive new revenue streams. ABI’s own research visionaries take stances early on those technologies, publishing groundbreaking studies often years ahead of other technology advisory firms. ABI analysts deliver their conclusions and recommendations in easily and quickly absorbed formats to ensure proper context. Our analysts strategically guide visionaries to take action now and inspire their business to realize a bigger picture.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.