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Global Sourcing Spotlight: A World Full of Product ExpertiseMacDermid Alpha Announces Global Availability of MultiPrep 200 Soldermask Adhesion Promoter
November 18, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions announces the global availability of the MultiPrep 200 copper surface treatment for solder mask adhesion to printed circuit board fabricators. When used as a solder mask preclean, MultiPrep 200 provides improved adhesion when compared to other mechanical or chemical pretreatments and reduces costs by replacing expensive-to-maintain mechanical roughening equipment. The process is available immediately.
The MultiPrep 200 copper surface treatment is a chemical roughening process that provides an ideal surface for maximizing the adhesion of solder mask, dry film, and liquid photo resist to copper traces on the surface of printed circuit boards. MultiPrep 200 provides a superior bond compared to that of mechanical roughening processes like pumice jet and scrub, allowing the solder mask interface to remain intact through final finish processing and tough assembly conditions.
“We are really excited to be able to offer the incredible value of MultiPrep 200 to our customers in all parts of the globe. The cost savings that PCB fabricators can achieve from switching off their expensive and high maintenance mechanical roughening equipment and switching to the ease of the fully wet processing adhesion solution provided by MultiPrep 200 will make it an attractive option for nearly any circuit board factory;” said Rich Retallick, Director of Electronics Specialties.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
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