-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Crowns Hand Soldering World Champion in Munich
November 21, 2019 | IPCEstimated reading time: 1 minute
IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.
Tasked with completing a very complex circuit board assembly with dozens of components, nearly 200 solder joints within a 60-minute time limit, and fully compliant with IPC Class 3 standards requirements, contestants faced a significant challenge.
Rising to the challenge, Indra Setiawan, PT SIIX EMS, Indonesia, completed the printed board assembly within 56 minutes, scored 321 points out of 340, and earned the title of IPC hand soldering world champion. In addition to his title, a cash prize of €1000, Setiawan received a soldering station from sponsors JBC Tools, HAKKO and Almit. Pauline Duval, Thalès DMS, France, took second place with a score of 318 points, and earned €500. Duval qualified for the championship just the day before by winning the regional competition. With a score of 316 points, third place and €300 went to Maricel Calabig Velasco, Integrated Micro-electronics Inc., Philippines.
“The competitors brought their best skills to meet the requirements of this year’s challenge,” said Philippe Léonard, director, IPC Europe. “It’s intricate work, especially as components keep getting smaller and smaller. This was a very challenging competition and we had a very talented field of competitors from around the world showcasing their skills.”
Assemblies were judged on soldering in accordance with IPC-A-610G Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. International MIT judges from China, Estonia, France, Holland and the United States provided their expertise judging the competition, and IPC thanks Patrick Mellet, IFTEC, France; Marcin Sudomir, Renex, Poland; Thomas Ahrens, Ph.D., Trainanlytics, Germany; Stefan Walls, PIEK, The Netherlands; Jack Shi, IPC Asia/Pacific; and Johnson Stephen Muriel, IPC Asia/Pacific.
In addition, IPC thanks 2019 Hand Soldering World Championship Gold sponsors JBC Tools, HAKKO, Reeco and Thalès and Silver sponsors Optilia, The Daylight Company, Almit, NCAB and Zestron for their enthusiastic support this year.
For information on upcoming IPC Hand Soldering Competitions, visit www.ipc.org/events.
Check out I-Connect007's video coverage of the IPC hand soldering competition in Munich.
Suggested Items
Altus Highlights Success of Essemtec's I2S in the UK and Ireland Market
07/23/2024 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, is pleased to highlight the success of Essemtec's Integrated Inspection System (I2S).
Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
07/23/2024 | ASMPTASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
07/10/2024 | SMTAThe SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.