-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Crowns Hand Soldering World Champion in Munich
November 21, 2019 | IPCEstimated reading time: 1 minute

IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.
Tasked with completing a very complex circuit board assembly with dozens of components, nearly 200 solder joints within a 60-minute time limit, and fully compliant with IPC Class 3 standards requirements, contestants faced a significant challenge.
Rising to the challenge, Indra Setiawan, PT SIIX EMS, Indonesia, completed the printed board assembly within 56 minutes, scored 321 points out of 340, and earned the title of IPC hand soldering world champion. In addition to his title, a cash prize of €1000, Setiawan received a soldering station from sponsors JBC Tools, HAKKO and Almit. Pauline Duval, Thalès DMS, France, took second place with a score of 318 points, and earned €500. Duval qualified for the championship just the day before by winning the regional competition. With a score of 316 points, third place and €300 went to Maricel Calabig Velasco, Integrated Micro-electronics Inc., Philippines.
“The competitors brought their best skills to meet the requirements of this year’s challenge,” said Philippe Léonard, director, IPC Europe. “It’s intricate work, especially as components keep getting smaller and smaller. This was a very challenging competition and we had a very talented field of competitors from around the world showcasing their skills.”
Assemblies were judged on soldering in accordance with IPC-A-610G Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. International MIT judges from China, Estonia, France, Holland and the United States provided their expertise judging the competition, and IPC thanks Patrick Mellet, IFTEC, France; Marcin Sudomir, Renex, Poland; Thomas Ahrens, Ph.D., Trainanlytics, Germany; Stefan Walls, PIEK, The Netherlands; Jack Shi, IPC Asia/Pacific; and Johnson Stephen Muriel, IPC Asia/Pacific.
In addition, IPC thanks 2019 Hand Soldering World Championship Gold sponsors JBC Tools, HAKKO, Reeco and Thalès and Silver sponsors Optilia, The Daylight Company, Almit, NCAB and Zestron for their enthusiastic support this year.
For information on upcoming IPC Hand Soldering Competitions, visit www.ipc.org/events.
Check out I-Connect007's video coverage of the IPC hand soldering competition in Munich.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.