-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
TAKAYA 10-Probe Fixtureless Test Technology on Exhibit at APEX 2020
January 9, 2020 | TakayaEstimated reading time: 1 minute

TEXMAC will exhibit the latest TAKAYA technology for fixtureless testing at the upcoming APEX 2020 conference and show in San Diego in February. On exhibit will be two systems, their model APT-1600FD double-sided flying probe test system and the APT-1400F series, both in booth #2347. TEXMAC USA is TAKAYA’s North American distributor.
The remarkable APT-1600FD Advanced Flying Probe test system employs 10 flying probes to provide fixtureless electrical testing that includes optical inspection and LED color and luminous verification on both sides of the board simultaneously. Its new 10-flying-Z-axis design includes 4 vertical flying probes that provide unequalled access to test points where conventional angled probes cannot make contact. It also incorporates state-of-the-art motor drive, high-end precision instrumentation on the test head, and advanced vision systems, all to provide the fastest, highest and most accurate fault coverage and throughput. Major new capabilities include NSW (Net Signal Wave) for significantly decreasing test time, and a Laser Displacement Measurement System for detecting variances in component heights and to provide compensation for board warpage.
In addition to the APT-1600FD, The APT-1400F-A single-side automated flying probe test system will be demonstrated interfaced with a Nutek board loader. This configuration offers the option for the system to automatically accept the board under test from a board loader or directly from a conveyor.
The TAKAYA APT-1400F series flying probe test systems for assembled PCBAs can double the throughput of existing models, making it the industry’s fastest flying-probe test system. Both the single- and dual-sided mobile probe systems can be optionally equipped with LED Color Sensors that enable the functional testing of LEDs. Color spectrum (RGB) and Luminance parameters of the LED can be verified to ensure that component specifications are met.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).