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Have SPI and AOI but not RPI? Meet KiC at SMTA Chihuahua
February 26, 2020 | KIC ThermalEstimated reading time: Less than a minute

KIC announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, March 19, 2020 at the Villarreal Eventos in Chihuahua, CP. Miguel Carbajal, KIC’s Mexico Sales Manager, will discuss the company’s Smart Factory solutions that provide process control, traceability, automation, connectivity, data collection and analytics, and fast and easy integration for i4.0.
Have SPI and AOI but not RPI? Find out what you’re missing without Reflow Process Inspection. With RPI i4.0, and KIC’s NPI and process setup tools, all relevant data can connect to the factory MES or your factory data collection system to be easily analyzed and shared with personnel for clear factory analytics, optimization and corrective action.
Move toward the future of line connectivity, flexible production, machine learning and real-time insight. For more information about KIC, visit www.kicthermal.com.
Suggested Items
July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X
07/17/2025 | TrendForceTrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.