-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
NCAB: A ‘Hub’ That Works With Designers From Start to Finish
March 3, 2020 | Real Time with...IPCEstimated reading time: Less than a minute

During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview from the show, Guest Editor Kelly Dack meets with Ruben Contreras, field applications engineer at NCAB Group, and Shaun Salas, key account manager.
Shaun and Ruben discuss a variety of ways to overcome challenges with tariffs and broker relationships, as well as emphasizing upstream expertise and how the company operates as a "hub." Part of NCAB’s objective is to work with designers and design engineers to make the board more manufacturable.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26-28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
Suggested Items
Cadence Joins Intel Foundry Accelerator Design Services Alliance
03/17/2025 | Cadence Design SystemsCadence is expanding its collaboration with Intel Foundry by officially joining the Intel Foundry Accelerator Design Services Alliance! This collaboration amplifies both companies' efforts to drive innovation, support advanced chip design, and solidify Intel Foundry as a leader in cutting-edge semiconductor solutions.
Quest Global Acquires Alpha-Numero Technology Solutions
03/14/2025 | Quest GlobalQuest Global is pleased to announce the acquisition of Alpha-Numero Technology Solutions. Alpha-Numero is a US-based VLSI design company with expertise in FPGA.
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.