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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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NCAB: A ‘Hub’ That Works With Designers From Start to Finish
March 3, 2020 | Real Time with...IPCEstimated reading time: Less than a minute
During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview from the show, Guest Editor Kelly Dack meets with Ruben Contreras, field applications engineer at NCAB Group, and Shaun Salas, key account manager.
Shaun and Ruben discuss a variety of ways to overcome challenges with tariffs and broker relationships, as well as emphasizing upstream expertise and how the company operates as a "hub." Part of NCAB’s objective is to work with designers and design engineers to make the board more manufacturable.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26-28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
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Rachael Temple - AlltematedSuggested Items
Ignite Next Welcomes Synopsys to its Scale-up Program for Deep Tech Innovation
01/20/2026 | PRNewswireIgnite Next, the independent scale-up program for deep tech innovation, announced that Synopsys, the leader in engineering solutions from silicon to systems, has joined the program as a focus technology collaborator.
Announcing the New, Integrated I-Connect007 Magazine
01/20/2026 | I-Connect007 Editorial TeamDesign and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before. Today we are debuting I-Connect007 Magazine, which brings our Design007 Magazine and PCB007 Magazine under a single title. This evolution enables us to present a more comprehensive view of the PCB and interconnect lifecycle while maintaining the depth, technical rigor, and practical focus that you expect. Look inside!
Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
01/19/2026 | Edy Yu, Editor-in-Chief, ECIOThe Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Siemens Acquires ASTER Technologies to Deliver Industry-leading PCB Test Engineering Solutions
01/14/2026 | PRNewswireSiemens announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software.
Avnet Insights Survey: Engineers Embracing AI and Confronting Its Challenges
01/14/2026 | AvnetArtificial intelligence’s (AI) integration in designed products and solutions is here, and engineers are embracing the technology while identifying the challenges it may present.