Fresh PCB Concepts: The Journey of a PCB—A Tale of Sustainability and Circularity
Beyond Design: Integrated Circuit to PCB Integration
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming DownMeet Patrick Crawford, I-Connect007 Columnist
May 13, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Meet Patrick Crawford, one of our newest I-Connect007 columnists! Patrick’s columns will provide updates on IPC Design activities.
Patrick is the manager of design standards and related industry programs at IPC. Patrick manages the IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Data and Transfer Methodology Standard, IPC-2231 DFX Standard, and the IPC-175x family of materials and substances, lab report, and responsible minerals sourcing declaration standards. He is currently the liaison to the Design Community Leadership, the industry leadership group of IPC Design. Patrick and the Design Community Leadership work to develop the IPC Design program as IPC redoubles its efforts to serve the printed board design engineering industry.
Patrick earned his master’s degree in materials science and engineering from Portland State University in Portland, Oregon, where his studies focused on the growth of nanoscale carbon allotropes for use in next-generation memory devices and novel biomedical applications.
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