Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Meet Patrick Crawford, I-Connect007 Columnist
May 13, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Meet Patrick Crawford, one of our newest I-Connect007 columnists! Patrick’s columns will provide updates on IPC Design activities.
Patrick is the manager of design standards and related industry programs at IPC. Patrick manages the IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Data and Transfer Methodology Standard, IPC-2231 DFX Standard, and the IPC-175x family of materials and substances, lab report, and responsible minerals sourcing declaration standards. He is currently the liaison to the Design Community Leadership, the industry leadership group of IPC Design. Patrick and the Design Community Leadership work to develop the IPC Design program as IPC redoubles its efforts to serve the printed board design engineering industry.
Patrick earned his master’s degree in materials science and engineering from Portland State University in Portland, Oregon, where his studies focused on the growth of nanoscale carbon allotropes for use in next-generation memory devices and novel biomedical applications.
Read "Design Circuit" here on PCB Design007 or in Design007 Magazine. Subscribe today!
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.